Method for manufacturing housing

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United States of America Patent

PATENT NO 9921620
SERIAL NO

15348946

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Abstract

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A method for manufacturing a housing of an electronic device includes the following steps. An area not to be etched is shielded and an etching area is exposed. The etching area is etched by photolithography and forming a plurality of heat dissipation holes of nanometer scale in the etching area. The area not to be etched is cleaned for removing the shielding.

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Patent Owner(s)

Patent OwnerAddress
FULIAN YUZHAN PRECISION TECHNOLOGY CO LTDFOXCONN HONGGUAN SCIENCE PARK DASAN COMMUNITY GUANLAN STREET LONGHUA DISTRICT SHENZHEN CITY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hon, Kar-Wai New Taipei, TW 10 7
Liu, Sha-Sha Shenzhen, CN 6 9
Liu, Shyan-Juh New Taipei, TW 12 88

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