Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element

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United States of America Patent

PATENT NO 9920227
APP PUB NO 20160355709A1
SERIAL NO

15114983

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Abstract

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A resin composition comprising (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group and (c) a polymerization initiator, in which the absolute value of refractive index difference between the component (a) an acrylic polymer and the component (b) having at least one (meth)acryloyl group at 100° C. is 0.031 or less.

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Patent Owner(s)

  • HITACHI CHEMICAL COMPANY, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujii, Shinjiro Tokyo, JP 8 51
Ikeda, Aya Tokyo, JP 7 16
Katou, Sadaaki Tokyo, JP 7 37
Kimura, Mika Tokyo, JP 7 26

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