Wafer-level bonding packaging method and wafer structure
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United States of America Patent
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Mar 20, 2018
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app pub date -
Jul 19, 2016
filing date -
Jul 20, 2015
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Abstract
The present disclosure provides a wafer-level bonding packaging method, including: providing a plurality of first wafers and a plurality of second wafers, a to-be-bonded surface of a first wafer being a first to-be-bonded surface, a to-be-bonded surface of a second wafer being a second to-be-bonded surface, and the first to-be-bonded surface including a first region and a second region; forming at least one first bonding structure on the second region; forming at least one second bonding structure on a second to-be-bonded surface, the at least one second bonding structure corresponding to the at least one first bonding structure; and forming a supporting layer on the first region, a height of supporting layer being greater than a height of the first bonding structure and less than a sum of the height of the first bonding structure and a height of the second bonding structure.
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