Embossing tool and methods of preparation

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United States of America Patent

PATENT NO 9919553
SERIAL NO

14841560

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Abstract

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The present invention is directed to an embossing tool having a microstructure on its surface wherein the surface of the embossing tool has a thin layer of gold or an alloy thereof. Such an embossing tool not only can reduce adhesion between the surface of the embossing tool and a cured material, but also does not cause any significant change to the profile of the microstructure.

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Patent Owner(s)

Patent OwnerAddress
E INK CORPORATION1000 TECHNOLOGY PARK DRIVE BILLERICA MA 01821

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kang, Yih-Ming Fremont, US 14 99
Le, Du Quy San Jose, US 3 42
Li, Yu Fremont, US 376 3295
Liu, Hanan Milpitas, US 4 42
Schultz, Donald A San Jose, US 14 268

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