Polishing apparatus, polishing pad positioning method, and polishing pad
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United States of America Patent
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Mar 20, 2018
Issued Date -
N/A
app pub date -
Jul 1, 2014
filing date -
Jul 1, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
When a polishing pad is attached to a polishing table, the polishing pad can be easily positioned on and attached to the polishing table and air pockets are prevented from forming. As a position guide member 130 is inserted into a guide hole 109 with an attachment surface of a polishing pad 108 downward, the polishing pad 108 is positioned on and attached to a polishing table 110. At this time, the guide hole 109 of the polishing pad 108 is guided by the position guide member 130 and the polishing pad 108 is easily positioned so as to match the upper surface of the polishing table 110 with the outer periphery thereof. Then, as release paper is gradually peeled off from a rear surface of the polishing pad 108, the portion where the release paper is peeled off is attached to the polishing table 110.
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