Flux and solder material and method of making same
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United States of America Patent
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Mar 20, 2018
Grant Date -
Dec 22, 2011
app pub date -
Aug 10, 2011
filing date -
Feb 9, 2010
priority date (Note) -
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Abstract
A flux for use in soldering comprises a first constituent and one or more secondary constituents that is selected from solvents, thickeners, and/or metal oxide reducing agents. The flux has a temperature profile in which the flux is in a non-flowable inactive state at temperatures at and below a maximum storage temperature that is above about 27° C., a liquid active state at an activation temperature, and a flowable inactive state in a deposition temperature range above the maximum storage temperature and below the activation temperature. A solder material comprises solder particles dispersed in the flux.
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