Heat-bonding apparatus and method of manufacturing heat-bonded products
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United States of America Patent
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Mar 20, 2018
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app pub date -
Jan 9, 2014
filing date -
Jan 24, 2013
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Abstract
A heat-bonding apparatus and method of manufacturing a heat-bonded product not allowing the temperature of the object to be heat-bonded to overshoot greatly from a specified target temperature, and setting the temperature of the object to the target temperature in a shorter time and with higher efficiency and accuracy than the conventional when heat-bonding in vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for the buffer part in contact with the object in the chamber, a cooler for the buffer part, a sensor for detecting temperature of the object heated through the buffer part and a controller for controlling the temperature of the object to be the target temperature by adjusting heat discharge from the buffer part with the cooler based on the detected temperature of the object.
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