Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof
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United States of America Patent
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Mar 13, 2018
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N/A
app pub date -
Jul 11, 2014
filing date -
Mar 4, 2010
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Abstract
A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.
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