Light emitting diode package structure, backlight module and display device

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United States of America Patent

PATENT NO 9917233
SERIAL NO

14422141

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Abstract

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The present disclosure provides a light emitting diode (LED) package structure, a backlight module and a display device, and relates to the field of display technologies. The LED package structure includes an encapsulation housing and an LED chip encapsulated in the encapsulation housing. The encapsulation housing is a polyhedron which includes at least one inclined plane. One inclined plane of the encapsulation housing is a light exiting surface of the LED package structure.

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Patent Owner(s)

Patent OwnerAddress
BOE TECHNOLOGY GROUP CO LTDBEIJING 100015
BEIJING BOE DISPLAY TECHNOLOGY CO LTDNO 118 JINGHAIYILU BDA BEIJING 100176

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bai, Ling Beijing, CN 18 29
Bu, Zhanchang Beijing, CN 57 129
Lu, Kun Beijing, CN 97 258
Wang, Hetao Beijing, CN 25 18
Yan, Kai Beijing, CN 37 112

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