Electrical contact structure for a semiconductor component, and semiconductor component
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United States of America Patent
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Mar 13, 2018
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app pub date -
May 22, 2015
filing date -
May 28, 2014
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Abstract
An electrical contact structure (10) for a semiconductor component (100) is specified, comprising a transparent electrically conductive contact layer (1), on which a first metallic contact layer (2) is applied, a second metallic contact layer (3), which completely covers the first metallic contact layer (2), and a separating layer (4), which is arranged between the transparent electrically conductive contact layer (1) and the second metallic contact layer (3) and which separates the second metallic contact layer (3) from the transparent electrically conductive contact layer (1).
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