Hybrid bonding system and cleaning method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 13, 2018
Issued Date -
N/A
app pub date -
Mar 31, 2015
filing date -
Mar 31, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of cleaning an apparatus for processing a semiconductor wafer includes providing a first device having a first surface configured to load a first semiconductor wafer, a second device having a second surface configured to load a second semiconductor wafer, and a first cleaning module; and cleaning the second surface by moving the first cleaning module across the second surface in a first direction with respect to the second device.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully