2.5D microelectronic assembly and method with circuit structure formed on carrier
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United States of America Patent
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Mar 13, 2018
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N/A
app pub date -
May 5, 2016
filing date -
May 8, 2015
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Abstract
A dielectric element has a plurality of contacts at a first surface and a plurality of first traces coupled thereto which extend in directions parallel to the first surface. A circuit structure made of a plurality of dielectric layers and electrically conductive features thereon includes a plurality of bumps at a first surface which face the contacts of the dielectric element and are joined thereto. Circuit structure contacts at a second surface opposite the first surface are electrically coupled with the bumps through second traces on the circuit structure, the circuit structure contacts configured for connection with a plurality of element contacts of each of a plurality of microelectronic elements, wherein the microelectronic elements can be assembled therewith such that element contacts thereof face and are joined with the circuit structure contacts.
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