Multicomponent heat sink with movable fin support portion
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United States of America Patent
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Mar 13, 2018
Issued Date -
N/A
app pub date -
Jun 26, 2012
filing date -
Jun 26, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A heat sink comprises a base and a fin support larger in area than the base and supporting fins that may be positioned in a plurality of orientations relative to the base. The base is adapted for being connected to a heat-generating electronic component on a circuit board, and the heat sink dissipates heat generated by the heat-generating electronic device and conducted through the base and the fin support to the fins supported thereon. The heat sink dissipates heat from the heat-generating electronic device in a first operable position and in a second operable position. The heat sink may be moved from the first to the second operable position to facilitate access to electrical contacts proximal the heat-generating electronic component.
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