Method for detecting a thinning of the semiconductor substrate of an integrated circuit from its back face and corresponding integrated circuit
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 13, 2018
Issued Date -
N/A
app pub date -
Jul 25, 2016
filing date -
Feb 22, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
The thinning of a semiconductor substrate of an integrated circuit from a back face is detected using the measurement of a physical quantity representative of the resistance between the ends of two electrically-conducting contacts situated at an interface between an insulating region and an underlying substrate region. The two electrically-conducting contacts extend through the insulating region to reach the underlying substrate region.
First Claim
Other Claims data not available
Family
Loading Family data...
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Sep 13, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 13, 2029 |
