Active cooling debris bypass fin pack
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United States of America Patent
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Mar 13, 2018
Grant Date -
Feb 2, 2017
app pub date -
Aug 29, 2016
filing date -
Apr 3, 2012
priority date (Note) -
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Abstract
Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, a cooling system in a computing device may include a heatpipe which moves heat along a fin pack. The fin pack may include top and bottom ends as well as a plurality of fins. The fins may extend only a portion of the way between the ends thus creating an air duct. The air duct may allow debris to move along an edge of the fin and out of the computing device. The fins may also be curved to promote the forcing of debris through the fin pack while still allowing the heat to be expelled through the fins.
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