Method for anchoring a conductive cap on a filled via in a printed circuit board and printed circuit board with an anchored conductive cap
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United States of America Patent
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Mar 6, 2018
Issued Date -
N/A
app pub date -
Apr 23, 2015
filing date -
Apr 23, 2015
priority date (Note) -
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Abstract
The present invention relates to forming an anchored cap in a filled via in a PCB. The cap is formed by making an anchor opening in the filled via, depositing copper into the anchor opening to form an anchor portion, and subsequently depositing a cap portion over the filled via and the anchor portion, so that the anchored cap is anchored to the filled via by the anchor portion. In another embodiment, the anchor portion and cap portion may be deposited in one step.
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