Resin composition for sealing organic electroluminescent element, sealing film for organic electroluminescent element, gas-barrier film for organic electroluminescent element, and organic electroluminescent element using these films

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United States of America Patent

PATENT NO 9913324
SERIAL NO

14566961

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Abstract

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A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.

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Patent Owner(s)

  • FURUKAWA ELECTRIC CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishiguro, Kunihiko Tokyo, JP 9 20
Mieda, Tetsuya Tokyo, JP 22 50
Mihara, Naoaki Tokyo, JP 16 75
Nakamura, Toshimitsu Tokyo, JP 18 58

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