Semiconductor device and semiconductor manufacturing process
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 6, 2018
Issued Date -
N/A
app pub date -
Oct 26, 2016
filing date -
Oct 26, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device includes a first semiconductor die, a second semiconductor die and a plurality of supporting structures. The first semiconductor die includes a plurality of first bumps disposed adjacent to a first active surface thereof. The second semiconductor die includes a plurality of second bumps disposed adjacent to a second active surface thereof. The second bumps are bonded to the first bumps. The supporting structures are disposed between the first active surface of the first semiconductor die and the second active surface of the second semiconductor die. The supporting structures are electrically isolated and are disposed adjacent to a peripheral region of the second active surface of the second semiconductor die.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2016 Application Filing Year
- H01L Class
- 27971 Applications Filed
- 23507 Patents Issued To-Date
- 84.05 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 7 Age
Maintenance Fees
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|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Sep 6, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 6, 2029 |