Wiring board including multiple wiring layers that are different in surface roughness
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United States of America Patent
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Mar 6, 2018
Issued Date -
N/A
app pub date -
Aug 23, 2016
filing date -
Oct 2, 2015
priority date (Note) -
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Abstract
A wiring board includes an insulating layer, a first wiring layer, and a second wiring layer. The first wiring layer is formed in a first surface of the insulating layer, and includes a pad on which a semiconductor chip is to be mounted and a wiring pattern. The second wiring layer is formed on a second surface of the insulating layer opposite to the first surface. The roughness of a surface of the first wiring layer exposed at the first surface of the insulating layer is smaller than the roughness of a surface of the second wiring layer exposed on the second surface of the insulating layer.
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