Substrate with integrated heat spreader
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 6, 2018
Issued Date -
N/A
app pub date -
Oct 17, 2016
filing date -
Jun 13, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present disclosure relates to a substrate with an integrated heat spreader. The disclosed substrate includes a substrate core, at least one connecting structure, and a heat spreader. The substrate core has a top surface and a bottom surface opposite the top surface of the substrate. The at least one connecting structure extends through the substrate core from the top surface of the substrate core to the bottom surface of the substrate core. And the heat spreader extends through the substrate core from the top surface of the substrate core to a bottom level that is below the bottom surface of the substrate core.
First Claim
Other Claims data not available
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- H01L Class
- 23.71 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Sep 6, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 6, 2029 |
