Encapsulation system and method having variable output for heating encapsulant
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United States of America Patent
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Mar 6, 2018
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N/A
app pub date -
Mar 17, 2015
filing date -
Oct 23, 2014
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Abstract
The present disclosure discloses an encapsulation system and an encapsulation method, the encapsulation system including a thickness detection unit, an output control unit and an energy output unit, the thickness detection unit being connected with the output control unit, and the output control unit being connected with the energy output unit. The thickness detection unit is configured to detect a thickness of an encapsulant at a to-be-heated location in a component to be encapsulated and generate corresponding thickness information. The output control unit is configured to generate corresponding output control information depending on the thickness information. The energy output unit is configured to output, depending on the output control information, to the encapsulant at the to-be-heated location energy for heating the encapsulant.
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