Composite substrate, elastic wave device, and method for producing elastic wave device
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United States of America Patent
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Mar 6, 2018
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N/A
app pub date -
Jul 29, 2015
filing date -
Feb 19, 2013
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Abstract
A composite substrate 10 is formed by bonding together a piezoelectric substrate 12 and a support substrate 14 that has a lower thermal expansion coefficient than the piezoelectric substrate. The support substrate 14 is formed by directly bonding together a first substrate 14a and a second substrate 14b at a strength that allows separation with a blade, the first and second substrates being formed of the same material, and a surface of the first substrate 14a is bonded to the piezoelectric substrate 12, the surface being opposite to another surface of the first substrate 14a bonded to the second substrate 14b.
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