Semiconductor device leadframe
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United States of America Patent
Stats
-
Mar 6, 2018
Issued Date -
N/A
app pub date -
Dec 28, 2016
filing date -
Sep 26, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
For so called film assisted molding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
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