Apparatus and method for etching substrate, stamp for etching substrate and method for manufacturing the same

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United States of America Patent

PATENT NO 9911615
APP PUB NO 20160020112A1
SERIAL NO

14800456

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Abstract

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The inventive concepts relate to an apparatus and a method for etching a substrate, a stamp for etching a substrate, and a method for manufacturing the stamp. The method for etching a substrate includes bringing a substrate into contact with a stamp including a pattern on which a metal catalyst is formed, and etching the substrate by a chemical reaction between the metal catalyst and an etching solution.

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Patent Owner(s)

Patent OwnerAddress
INDUSTRY-ACADEMIC COOPERATION FOUNDATION YONSEI UNIVERSITYSEOUL CITY KOREA SEOUL

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Keorock Incheon, KR 3 3
Ki, Bugeun Incheon, KR 3 3
Kim, Kyung Ho Seoul, KR 183 1623
Oh, Jungwoo Incheon, KR 3 3
Song, Yunwon Incheon, KR 2 3

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