Card and corresponding method of manufacture
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United States of America Patent
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Mar 6, 2018
Issued Date -
N/A
app pub date -
Aug 26, 2016
filing date -
Aug 27, 2015
priority date (Note) -
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Abstract
A card has: a substrate of ID-1 format according to the ISO 7810 standard; and at least one electronic component arranged on the substrate, all or part of said at least one electronic component being disposed in at least one of the two embossing regions defined in the ISO 7811-1 standard as regions in which embossed characters can be formed on the substrate; an encapsulation of the unit comprising the substrate and said at least one electronic component; such that the thickness of the card at the level of said embossing regions does not exceed 1.32 mm.
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