Methods, systems, and articles of manufacture for implementing an electronic design with solid-fluid analysis driven techniques
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United States of America Patent
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Mar 6, 2018
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app pub date -
Jun 30, 2016
filing date -
Jun 30, 2016
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Abstract
The described techniques implement electronic designs with thermal analyses of the electronic design and its surrounding medium by performing thermal modeling that determines at least a thermal RC network for an electronic design. These techniques further generate a thermal network for the electronic design and one or more surrounding media of the electronic design and generate or modify the electronic design with an implementation process at least by guiding the implementation process based in part or in whole upon results of performing one or more thermal analysis on the thermal network.
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