Micro-perforation overmolding gate
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United States of America Patent
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Mar 6, 2018
Issued Date -
N/A
app pub date -
Jul 31, 2015
filing date -
Nov 12, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic device having protruding features and a method for molding the protruding features to the electronic device are described. The protruding features may be formed by a molding tool that releases a material that flows through several apertures of a substrate. Also, the molding tool is positioned with respect to the substrate such that the material from the molding tool flows from an interior region of the substrate to an exterior region of the substrate via the several apertures. Accordingly, each aperture extends from an opening of the interior region and to an opening of the exterior region of the substrate. In some cases, the apertures may include a conical shape. For example, the opening in the interior region may include a diameter greater than a diameter of the opening in the exterior region. In this manner, the material, when cured, is mechanically secured to the substrate.
First Claim
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International Classification(s)
- F21V:FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- G06F:ELECTRIC DIGITAL DATA PROCESSING
- B29K:INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, ....
- B29L:INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RE....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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