Resist underlayer film-forming composition and method for forming resist pattern using the same

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United States of America Patent

PATENT NO 9910354
SERIAL NO

15305793

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A composition for forming a resist underlayer film which make possible to form a desired high-adhesion resist pattern. A resist underlayer film-forming composition for lithography containing a polymer having the following structure Formula (1) or (2) at a terminal of a polymer chain, crosslinker, compound promoting crosslinking reaction, and organic solvent.

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NISSAN CHEMICAL INDUSTRIES LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujitani, Noriaki Toyama, JP 19 136
Nishita, Tokio Toyama, JP 31 32
Sakaida, Yasushi Toyama, JP 30 137
Sakamoto, Rikimaru Toyama, JP 115 978

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