Microfabricated ultrasonic transducers and related apparatus and methods
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United States of America Patent
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Mar 6, 2018
Issued Date -
N/A
app pub date -
Jun 9, 2016
filing date -
Jul 14, 2014
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Abstract
Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B06B:GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS I....
- B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
- G01N:INVESTIGATING OR ANALYSING MATERIALS BY DETERMININ....
- A61B:DIAGNOSIS; SURGERY; IDENTIFICATION
- B81B:MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-ME....
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