Recursive pumping for symmetrical gas exhaust to control critical dimension uniformity in plasma reactors
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United States of America Patent
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Mar 6, 2018
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Aug 5, 2014
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Aug 12, 2013
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Abstract
Embodiments of the present invention provide apparatus and methods for reducing non-uniformity and/or skews during substrate processing. One embodiment of the present invention provides a flow equalizer assembly for disposing between a vacuum port and a processing volume in a processing chamber. The flow equalizing assembly includes a first plate having at least one first opening, and a second plate having two or more second openings. The first and second plates define a flow redistributing volume therebetween, and the at least one first opening and the two or more second openings are staggered.
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