Ephemeral bonding

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United States of America Patent

PATENT NO 9909040
SERIAL NO

14992251

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Abstract

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Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

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Patent Owner(s)

Patent OwnerAddress
DDP SPECIALTY ELECTRONIC MATERIALS US INC1501 LARKIN CENTER DRIVE MIDLAND MI 48642

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bai, Zhifeng Midland, US 26 29
Brantl, Karen R West Springfield, US 12 125
Gallagher, Michael K Hopkinton, US 91 1302
Iagodkine, Elissei Marlborough, US 11 34
Oliver, Mark S Charlestown, US 11 20
Tucker, Christopher J Midland, US 55 534
Wang, Zidong Southborough, US 28 73

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