Multilayer capacitors, method for making multilayer capacitors
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United States of America Patent
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Mar 6, 2018
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N/A
app pub date -
Jun 20, 2012
filing date -
Jun 2, 2009
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Abstract
The invention provides a stacked capacitor configuration comprising subunits each with a thickness of as low as 20 microns. Also provided is combination capacitor and printed wire board wherein the capacitor is encapsulated by the wire board. The invented capacitors are applicable in micro-electronic applications and high power applications, whether it is AC to DC or DC to AC, or DC to DC.
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