Method for achieving good adhesion between dielectric and organic material
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United States of America Patent
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Mar 6, 2018
Grant Date -
Aug 4, 2016
app pub date -
Sep 15, 2014
filing date -
Oct 2, 2013
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Abstract
The present invention generally relates to a method for forming a MEMS device and a MEMS device formed by the method. When forming the MEMS device, sacrificial material is deposited around the switching element within the cavity body. The sacrificial material is eventually removed to free the switching element in the cavity. The switching element has a thin dielectric layer thereover to prevent etchant interaction with the conductive material of the switching element. During fabrication, the dielectric layer is deposited over the sacrificial material. To ensure good adhesion between the dielectric layer and the sacrificial material, a silicon rich silicon oxide layer is deposited onto the sacrificial material before depositing the dielectric layer thereon.
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