System and method for extruding parts having microstructures

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United States of America Patent

PATENT NO 9908274
SERIAL NO

14811523

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Abstract

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This invention is directed to a microstructured filament that can be used to make fibers having an extruded filament having pre-cooled microfeatures in a radial spiral arrangement about a bore though the filament wherein the microfeature has a width in the range of 25 μm to 40 μm and height in the range of 90 μm to 100 μm; and, the filament having a post-cooled state having post-cooled microfeatures having physical dimensions smaller than that of the pre-cooled microfeatures. The filament can include microfeatures having a width in the range of 400 nm to 4 μm and height in the range of 400 nm to 4 μm. The filament and fiber can include physical characteristics selected from the group consisting of: hydrophobicity, self-cleaning, increased hydro-dynamic drag coefficients, decreased or increased aerodynamic drag coefficients, increased friction, reduced friction, optical effects, increased adhesion, decreased adhesion, oleophobicity, tactile effects, anti-blocking and any combination of these.

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Patent Owner(s)

Patent OwnerAddress
HOOWAKI LLC400 BIRNIE STREET SUITE C GREENVILLE SC 29611

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cannon, Andrew H Columbia, US 11 208
Hulseman, Carl Greenville, US 1 27
Hulseman, Ralph A Greenville, US 17 309
King, William P Champaign, US 33 613
Maguire, March Clemson, US 8 104

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