Electronic module
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United States of America Patent
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Feb 27, 2018
Grant Date -
Jun 16, 2016
app pub date -
Jul 3, 2014
filing date -
Jul 30, 2013
priority date (Note) -
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Abstract
An electronic module is provided that includes a multilayer circuit board, and an electronic component, and a Peltier heat pump. The electronic component is mounted on a major surface of the multilayer circuit board and is electrically coupled to at least one memory die. The at least one memory die is at least partially embedded within the multilayer circuit board. The Peltier heat pump device has at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, and the at least one pair of semiconductor members are at least partially embedded in the circuit board.
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