Electronic circuit package
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United States of America Patent
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Feb 27, 2018
Issued Date -
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app pub date -
Apr 25, 2016
filing date -
Apr 25, 2016
priority date (Note) -
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Abstract
Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a magnetic mold resin formed of a composite magnetic material including a thermosetting resin material and a magnetic filler, the magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component; and a metal film connected to the power supply pattern and covering at least a top surface of the magnetic mold resin. A volume resistance value of the magnetic mold resin is equal to or larger than 1010Ω, and a resistance value at an interface between the top surface of the magnetic mold resin and the metal film is equal to or larger than 106Ω.
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