Method for manufacturing a printed circuit board with high-capacity copper circuit
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United States of America Patent
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Feb 27, 2018
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N/A
app pub date -
Dec 29, 2016
filing date -
Oct 6, 2016
priority date (Note) -
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Abstract
A printed circuit board with high-capacity copper circuit includes a conductive trace, a first protecting layer, and a second protecting layer formed on opposite sides of the conductive trace. The conductive trace includes a base conductive trace pattern, a first conductive trace pattern, and a second conductive trace pattern. The first and second conductive trace patterns are directly formed on opposite surfaces of the base copper conductive trace pattern. A trace width of the first conductive trace pattern is the same as a line width of the second conductive trace pattern.
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