Substrate structure and fabrication method thereof
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United States of America Patent
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Feb 27, 2018
Issued Date -
N/A
app pub date -
Aug 23, 2015
filing date -
Oct 29, 2014
priority date (Note) -
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Abstract
A method for fabricating a substrate structure is provided, which includes the steps of: disposing at least a strengthening member on a carrier; sequentially forming a first circuit layer and a dielectric layer on the carrier, wherein the strengthening member is embedded in the dielectric layer; forming a second circuit layer on the dielectric layer; removing the carrier; and forming an insulating layer on the first circuit layer and the second circuit layer. The strengthening member facilitates to reduce thermal warping of the substrate structure.
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