Silver-plated product

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United States of America Patent

PATENT NO 9905951
SERIAL NO

14384972

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Importance

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Abstract

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There is provided a silver-plated product wherein a silver plating film having a thickness of not greater than 10 micrometers is formed on a base material of copper or a copper alloy and wherein the surface of the silver plating film has an arithmetic average roughness Ra of not greater than 0.1 micrometers, and the silver plating film has a {111} orientation ratio of not less than 35%.

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Patent Owner(s)

Patent OwnerAddress
DOWA METALTECH CO LTDTOKYO JAPAN TOKYO METROPOLIS

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miyazawa, Hiroshi Saitama, JP 107 941
Ogata, Masafumi Saitama, JP 12 29
Shinohara, Keisuke Saitama, JP 52 231

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