MINIATURE DIRECTIONAL COUPLING DEVICE

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United States of America Patent

SERIAL NO

15252212

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Abstract

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Differing from conventional directional coupling device being implemented on a coin-like planar board, the present invention stacks a bottom substrate, at least one phase retarding unit, at least one reference ground unit, a coupled circuit layer, a main circuit layer, and a top substrate to form a miniature directional coupling device. Because this miniature directional coupling device not occupies too much circuit area when being applied in a mobile communication product, the miniature directional coupling device can meet the requirements of light weight and compact size demanded by high-technology mobile communications for the electronic components. It is worth explaining that, since the said phase retarding unit consists of many end-to-end connected transmission wires, engineers skilled in designing microwave circuit are able to carry out the modulation of coupling flatness of the miniature directional coupling device by changing a total length of the end-to-end connected transmission wires.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED CERAMIC X CORPORATION12F NO 52 SEC 2 SHUANG SHIH ROAD PANCHIAO TAIPEI

International Classification(s)

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  • 2016 Application Filing Year
  • H01P Class
  • 694 Applications Filed
  • 597 Patents Issued To-Date
  • 86.03 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LEE, WEI-JEN Hsinchu County, TW 15 42
LYU, JHIN-YING Nantou County, TW 3 9
SHEEN, JYH-WEN Hsinchu County, TW 18 416

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Patent Citation Ranking

  • 2 Citation Count
  • H01P Class
  • 35.54 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges156260122521101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6071 - 80020406080100120140160180200220240260280

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