Method of manufacturing wafer level packaging including through encapsulation vias
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United States of America Patent
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Feb 27, 2018
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N/A
app pub date -
Jul 15, 2015
filing date -
Jun 9, 2015
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Abstract
Provided is a method of manufacturing a wafer level package. The method includes forming a repassivation layer that encapsulates a plurality of semiconductor chips isolated from a wafer, forming a through encapsulation via (TEV) in the repassivation layer, forming a redistribution layer electrically connected to the TEV, and forming a bump ball on the redistribution layer.
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