Method for manufacturing semiconductor light-emitting device and semiconductor light-emitting device
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United States of America Patent
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Feb 27, 2018
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app pub date -
May 17, 2016
filing date -
May 18, 2015
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Abstract
Methods for manufacturing semiconductor light-emitting devices and semiconductor light-emitting devices having a high radiating performance and can include a metallic laminate substrate, a semiconductor light-emitting chip and a transparent resin. The metallic laminate substrate can include a cavity so as to be able to accurately mount the light-emitting chip, and also can structures to efficiently radiate heat generated from the light-emitting chip. The transparent resin to encapsulate the semiconductor light-emitting chip in the cavity can include various wavelength converting materials. Additionally, the light-emitting devices can be manufactured in manufacturing processes similar to conventional light-emitting devices. Thus, the disclosed subject matter can provide semiconductor light-emitting devices having a high radiating performance and a high alignment accuracy, which can emit various color lights including a substantially white color tone, and therefore can be used as a light source for lighting units such as a vehicle headlight, general light, a stage lighting, etc.
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