Modular fuses and antifuses for integrated circuits
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United States of America Patent
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Feb 27, 2018
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N/A
app pub date -
Nov 10, 2015
filing date -
Jun 28, 2013
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Abstract
Nanoscale efuses, antifuses, and planar coil inductors are disclosed. A copper damascene process can be used to make all of these circuit elements. A low-temperature copper etch process can be used to make the efuses and efuse-like inductors. The circuit elements can be designed and constructed in a modular fashion by linking a matrix of metal columns in different configurations and sizes. The number of metal columns, or the size of a dielectric mesh included in the circuit element, determines its electrical characteristics. Alternatively, the efuses and inductors can be formed from interstitial metal that is either deposited into a matrix of dielectric columns, or left behind after etching columnar openings in a block of metal. Arrays of metal columns also serve a second function as features that can improve polish uniformity in place of conventional dummy structures. Use of such modular arrays provides flexibility to integrated circuit designers.
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