Electronic package
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United States of America Patent
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Feb 27, 2018
Issued Date -
N/A
app pub date -
May 6, 2016
filing date -
May 6, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
The disclosed embodiments of electronic packages include electrical contact pad features present on all sides of the package that facilitate simple and low cost electrical connections to the package made through a mechanical contacting scheme. In an embodiment, an electronic package comprises: a metal leadframe having a first leadframe portion having a first thickness and a second leadframe portion having a second thickness that is less than the first thickness, the second leadframe portion defining electrical contact pads; a silicon die attached to the second leadframe portion and overlying a space formed in the leadframe by the first and second leadframe portions; and wirebonds coupling the silicon die to the electrical contact pads. A method of fabricating the electronic package is also disclosed.
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