Method for fabricating array substrate, array substrate and display device

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United States of America Patent

PATENT NO 9905434
SERIAL NO

15022288

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Abstract

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The invention relates to a method for fabricating an array substrate, an array substrate and a display device. The method for fabricating an array substrate may comprise: forming a metal thin film layer for a source electrode, a drain electrode and a data line; forming a non-crystalline semiconductor thin film layer on the metal thin film layer; and performing annealing, so as to at least partly convert the non-crystalline semiconductor thin film layer into a metal semiconductor compound. By at least partly converting the non-crystalline semiconductor thin film layer into a metal semiconductor compound, the resulting metal semiconductor compound may prevent oxidative-corrosion of the metal thin film layer, such as a low-resistance metal (e.g., Cu or Ti) layer, in the subsequent procedures, which is favorable for the fabrication of a metal oxide thin film transistor using Cu or Ti.

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Patent Owner(s)

Patent OwnerAddress
BOE TECHNOLOGY GROUP CO LTD100015 NO 10 JIUXIANQIAO ROAD BEIJING CHAOYANG DISTRICT BEIJING CITY BEIJING CITY 100015

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Seungjin Beijing, CN 114 502
Song, Youngsuk Beijing, CN 80 356
Yoo, Seongyeol Beijing, CN 62 360

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