Method for processing semiconductor wafer, method for manufacturing bonded wafer, and method for manufacturing epitaxial wafer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 27, 2018
Issued Date -
N/A
app pub date -
Aug 19, 2015
filing date -
Sep 11, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Method for processing a semiconductor-wafer having a front surface, back surface, and chamfered-portion composed of a chamfered surface on the front surface side, a chamfered surface on the back surface side, and an end face at a peripheral end, including: mirror-polishing of each portion of the chamfered surface on the front surface side, the chamfered surface on the back surface side, the end face, and an outermost peripheral-portion on the front or back surface adjacent to the chamfered surface; wherein the end face mirror-polishing and mirror-polishing of the outermost peripheral-portion on the front or back surface are performed in one step, after step of mirror-polishing the chamfered surface on the front surface side and step of mirror-polishing the chamfered surface on the back surface side; roll-off amount of the outermost peripheral-portion on the front or back surface is adjusted by one step-performed mirror-polishing of the end face and outermost peripheral-portion.
First Claim
Other Claims data not available
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International Classification(s)
- 2015 Application Filing Year
- B24B Class
- 630 Applications Filed
- 508 Patents Issued To-Date
- 80.64 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B24B Class
- 0 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Aug 27, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 27, 2029 |
