Sputtering apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 27, 2018
Issued Date -
N/A
app pub date -
Oct 23, 2015
filing date -
May 31, 2013
priority date (Note) -
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Abstract
A sputtering apparatus includes a vacuum chamber, a substrate holder, a target support member, a cathode magnet arranged on a side of the target support member, which is opposite to a side of a substrate held by the substrate holder, a magnet moving unit configured to adjust a distance between the cathode magnet and the target support member, a target moving unit configured to adjust a distance between the target support member and the substrate, and a control unit configured to control the target moving unit and the magnet moving unit.
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