Method and apparatus for analyzing shape of wafer
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United States of America Patent
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Feb 27, 2018
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app pub date -
Jun 25, 2014
filing date -
Dec 24, 2013
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Abstract
A method for analyzing the shape of a wafer according to an embodiment comprises the steps of: acquiring a sectional image showing a wafer to be analyzed; finding a coordinate row of the surface contour of the wafer in the sectional image; and obtaining shape analysis data, including information about the shape of the wafer, using the coordinate row.
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