Method of reducing the dimension of an imprint structure on a substrate
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United States of America Patent
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Feb 27, 2018
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app pub date -
Aug 4, 2010
filing date -
Aug 4, 2009
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Abstract
A method of reducing the dimension of an imprint structure on a substrate, the method comprising the steps of:
- (a) providing a substrate having at least one imprint structure thereon, said structure being formed of an inorganic-organic compound comprising an inorganic moiety and a polymer moiety, said polymer moiety having a lower vaporization temperature than the melting point of said inorganic moiety; and(b) selectively removing at least part of the polymer moiety while enabling at least part of the inorganic moiety to form a substantially continuous inorganic phase in said imprint structure, wherein the removal of the at least part of the polymer moiety from the imprint structure reduces the dimension of the imprint structure.
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