Film formation method and film formation apparatus
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United States of America Patent
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Feb 27, 2018
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app pub date -
Dec 18, 2012
filing date -
Dec 18, 2012
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Abstract
A film formation method is one for forming an organic layer comprising a fluorine-containing resin on an inorganic layer (3) formed on a substrate and comprising an inorganic substance. In the method, for the formation of the inorganic layer, a reactive sputtering procedure using water vapor as a reactive gas is carried out to form the inorganic layer on the substrate. Subsequently, the organic layer is formed on the inorganic layer. A film formation device enables the implementation of the film formation method.
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